Effect of indium on wettability of Sn-Ag-Cu solders. Experiment vs. modeling, Part I
Identifieur interne : 005650 ( Main/Repository ); précédent : 005649; suivant : 005651Effect of indium on wettability of Sn-Ag-Cu solders. Experiment vs. modeling, Part I
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Abstract
The density and surface tension measurements of the Sn3.13Ag0.74Cu liquid alloys with 2, 3, 4, 15, 30, 50 and 75 at.% In additions were conducted in the temperature range from 431 K up to 1209 K by dilatometric technique and the maximum bubble pressure method, respectively. The results obtained in both techniques exhibited 2%-3% scattering of experimental errors, similarly to the previously investigated In-Sn and Sn-Ag-In systems. This was due to the very similar surface tension and density values of pure indium and tin. The experimental surface tensions were compared with calculated ones using data of the constituent systems, (a) by means of thermodynamic method of Butler, and (b) by the temperature and concentration relation of the surface tension. The improvement of wettability in liquid alloys containing different In additions was confirmed with a sessile drop method in the temperature interval 523 K-593 K up to 1800 s. The wetting angles decreased with temperature and increasing In concentrations in the solders from ∼37° for the solder without In at 523 K down to ∼22° for the solder with 75 at.% In at 593 K. In the following Part II, the structure investigations of the interface between relevant solder and Cu substrate of the same liquid solders after contact angle measurements will be carried out.
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<record><TEI><teiHeader><fileDesc><titleStmt><title xml:lang="en" level="a">Effect of indium on wettability of Sn-Ag-Cu solders. Experiment vs. modeling, Part I</title><author><name sortKey="Moser, Zbigniew" uniqKey="Moser Z">Zbigniew Moser</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Institute of Metallurgy and Materials Science, Polish Academy of Sciences (IMIM PAS), 25, Reymonta Street</s1><s2>30-059 Kraków</s2><s3>POL</s3><sZ>1 aut.</sZ><sZ>3 aut.</sZ><sZ>5 aut.</sZ></inist:fA14><country>Pologne</country><wicri:noRegion>30-059 Kraków</wicri:noRegion></affiliation></author><author><name sortKey="Sebo, Pavol" uniqKey="Sebo P">Pavol Sebo</name><affiliation wicri:level="1"><inist:fA14 i1="02"><s1>Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, 75, Racianska Street</s1><s2>831-02, Bratislava</s2><s3>SVK</s3><sZ>2 aut.</sZ></inist:fA14><country>Slovaquie</country><wicri:noRegion>831-02, Bratislava</wicri:noRegion></affiliation></author><author><name sortKey="Gasior, W Adys Aw" uniqKey="Gasior W">W Adys Aw Gasior</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Institute of Metallurgy and Materials Science, Polish Academy of Sciences (IMIM PAS), 25, Reymonta Street</s1><s2>30-059 Kraków</s2><s3>POL</s3><sZ>1 aut.</sZ><sZ>3 aut.</sZ><sZ>5 aut.</sZ></inist:fA14><country>Pologne</country><wicri:noRegion>30-059 Kraków</wicri:noRegion></affiliation></author><author><name sortKey="Svec, Peter" uniqKey="Svec P">Peter Svec</name><affiliation wicri:level="1"><inist:fA14 i1="03"><s1>Institute of Physics, Slovak Academy of Sciences, 9, Dubravska cesta</s1><s2>845-11 Bratislava</s2><s3>SVK</s3><sZ>4 aut.</sZ></inist:fA14><country>Slovaquie</country><wicri:noRegion>845-11 Bratislava</wicri:noRegion></affiliation></author><author><name sortKey="Pstrus, Janusz" uniqKey="Pstrus J">Janusz Pstrus</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Institute of Metallurgy and Materials Science, Polish Academy of Sciences (IMIM PAS), 25, Reymonta Street</s1><s2>30-059 Kraków</s2><s3>POL</s3><sZ>1 aut.</sZ><sZ>3 aut.</sZ><sZ>5 aut.</sZ></inist:fA14><country>Pologne</country><wicri:noRegion>30-059 Kraków</wicri:noRegion></affiliation></author></titleStmt><publicationStmt><idno type="inist">09-0275447</idno><date when="2009">2009</date><idno type="stanalyst">PASCAL 09-0275447 INIST</idno><idno type="RBID">Pascal:09-0275447</idno><idno type="wicri:Area/Main/Corpus">005529</idno><idno type="wicri:Area/Main/Repository">005650</idno></publicationStmt><seriesStmt><idno type="ISSN">0364-5916</idno><title level="j" type="abbreviated">Calphad</title><title level="j" type="main">Calphad</title></seriesStmt></fileDesc><profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Contact angle</term><term>Copper alloy</term><term>Eutectic</term><term>Indium</term><term>Lead free soldering</term><term>Liquid alloy</term><term>Modeling</term><term>Silver alloy</term><term>Solder</term><term>Surface properties</term><term>Tin alloy</term><term>Wettability</term></keywords><keywords scheme="Pascal" xml:lang="fr"><term>Indium</term><term>Mouillabilité</term><term>Produit apport brasage tendre</term><term>Modélisation</term><term>Brasage sans plomb</term><term>Eutectique</term><term>Angle contact</term><term>Alliage liquide</term><term>Etain alliage</term><term>Argent alliage</term><term>Cuivre alliage</term><term>Propriété surface</term></keywords></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en">The density and surface tension measurements of the Sn3.13Ag0.74Cu liquid alloys with 2, 3, 4, 15, 30, 50 and 75 at.% In additions were conducted in the temperature range from 431 K up to 1209 K by dilatometric technique and the maximum bubble pressure method, respectively. The results obtained in both techniques exhibited 2%-3% scattering of experimental errors, similarly to the previously investigated In-Sn and Sn-Ag-In systems. This was due to the very similar surface tension and density values of pure indium and tin. The experimental surface tensions were compared with calculated ones using data of the constituent systems, (a) by means of thermodynamic method of Butler, and (b) by the temperature and concentration relation of the surface tension. The improvement of wettability in liquid alloys containing different In additions was confirmed with a sessile drop method in the temperature interval 523 K-593 K up to 1800 s. The wetting angles decreased with temperature and increasing In concentrations in the solders from ∼37° for the solder without In at 523 K down to ∼22° for the solder with 75 at.% In at 593 K. In the following Part II, the structure investigations of the interface between relevant solder and Cu substrate of the same liquid solders after contact angle measurements will be carried out.</div></front></TEI><inist><standard h6="B"><pA><fA01 i1="01" i2="1"><s0>0364-5916</s0></fA01><fA02 i1="01"><s0>CCCTD6</s0></fA02><fA03 i2="1"><s0>Calphad</s0></fA03><fA05><s2>33</s2></fA05><fA06><s2>1</s2></fA06><fA08 i1="01" i2="1" l="ENG"><s1>Effect of indium on wettability of Sn-Ag-Cu solders. Experiment vs. modeling, Part I</s1></fA08><fA09 i1="01" i2="1" l="ENG"><s1>Experimental and Computational Investigation of Intermetallic Systems</s1></fA09><fA11 i1="01" i2="1"><s1>MOSER (Zbigniew)</s1></fA11><fA11 i1="02" i2="1"><s1>SEBO (Pavol)</s1></fA11><fA11 i1="03" i2="1"><s1>GASIOR (Władysłłłłław)</s1></fA11><fA11 i1="04" i2="1"><s1>SVEC (Peter)</s1></fA11><fA11 i1="05" i2="1"><s1>PSTRUS (Janusz)</s1></fA11><fA12 i1="01" i2="1"><s1>CACCIAMANI (Gabriele)</s1><s9>ed.</s9></fA12><fA12 i1="02" i2="1"><s1>BORZONE (Gabriella)</s1><s9>ed.</s9></fA12><fA12 i1="03" i2="1"><s1>SACCONE (Adriana)</s1><s9>ed.</s9></fA12><fA14 i1="01"><s1>Institute of Metallurgy and Materials Science, Polish Academy of Sciences (IMIM PAS), 25, Reymonta Street</s1><s2>30-059 Kraków</s2><s3>POL</s3><sZ>1 aut.</sZ><sZ>3 aut.</sZ><sZ>5 aut.</sZ></fA14><fA14 i1="02"><s1>Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, 75, Racianska Street</s1><s2>831-02, Bratislava</s2><s3>SVK</s3><sZ>2 aut.</sZ></fA14><fA14 i1="03"><s1>Institute of Physics, Slovak Academy of Sciences, 9, Dubravska cesta</s1><s2>845-11 Bratislava</s2><s3>SVK</s3><sZ>4 aut.</sZ></fA14><fA15 i1="01"><s1>Dipartimento di Chimica e Chimica Industriale, Universita di Genova, via Dodecaneso 31</s1><s2>16146 Genova</s2><s3>ITA</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ><sZ>3 aut.</sZ></fA15><fA20><s1>63-68</s1></fA20><fA21><s1>2009</s1></fA21><fA23 i1="01"><s0>ENG</s0></fA23><fA43 i1="01"><s1>INIST</s1><s2>16813</s2><s5>354000185962060110</s5></fA43><fA44><s0>0000</s0><s1>© 2009 INIST-CNRS. All rights reserved.</s1></fA44><fA45><s0>27 ref.</s0></fA45><fA47 i1="01" i2="1"><s0>09-0275447</s0></fA47><fA60><s1>P</s1></fA60><fA61><s0>A</s0></fA61><fA64 i1="01" i2="1"><s0>Calphad</s0></fA64><fA66 i1="01"><s0>NLD</s0></fA66><fC01 i1="01" l="ENG"><s0>The density and surface tension measurements of the Sn3.13Ag0.74Cu liquid alloys with 2, 3, 4, 15, 30, 50 and 75 at.% In additions were conducted in the temperature range from 431 K up to 1209 K by dilatometric technique and the maximum bubble pressure method, respectively. The results obtained in both techniques exhibited 2%-3% scattering of experimental errors, similarly to the previously investigated In-Sn and Sn-Ag-In systems. This was due to the very similar surface tension and density values of pure indium and tin. The experimental surface tensions were compared with calculated ones using data of the constituent systems, (a) by means of thermodynamic method of Butler, and (b) by the temperature and concentration relation of the surface tension. The improvement of wettability in liquid alloys containing different In additions was confirmed with a sessile drop method in the temperature interval 523 K-593 K up to 1800 s. The wetting angles decreased with temperature and increasing In concentrations in the solders from ∼37° for the solder without In at 523 K down to ∼22° for the solder with 75 at.% In at 593 K. 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